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According to Thelec, several South Korean companies specializing in optical communications are securing significant contracts to provide components and equipment for co-packaged optics (CPO). CPO is a pivotal technology that integrates optical engines directly with switch chips, facilitating the transmission of data via light rather than electrical signals. This transition is considered a cornerstone for silicon photonics as it addresses the increasing demand for high-speed, low-latency connectivity in AI data centers.
Key players and supply chain integration
Major industry participants are already integrating Korean technology into their global supply chains. RF Materials recently signed an agreement with Metallife-USA to provide pump laser packages. These lasers serve as core light sources for optical engines, specifically for Lumentum—a major CPO supplier that maintains a long-term partnership with Nvidia for silicon photonics applications.
Furthermore, ADS Tech, which was acquired by Sungho Electronics, has secured a diverse client base including Mellanox Technologies (an Nvidia subsidiary), Broadcom, and Corning. The company specializes in active alignment equipment, which ensures that optical fibers, lenses, and lasers are aligned with micron-level precision to minimize signal loss during assembly.
Advanced manufacturing and connectivity solutions
The expansion into CPO also involves specialized bonding and transceiver technologies:
Beyond the chip level, Korean firms are addressing long-distance connectivity. LiComm is supplying optical amplifiers to 1Finity for data center interconnect (DCI) applications, while TMC has signed agreements to provide optical cables for connecting servers and switches across large-scale AI infrastructures.
Future development and substrate innovation
Looking ahead, the industry is moving toward deeper integration of optical signals between GPUs and high-bandwidth memory (HBM). LC Square and Sigetronics are currently developing modules to link these components via optical signals, with a target commercialization date of 2028. Additionally, Chemtronics has identified CPO as a primary application for through-glass via (TGV) technologies, aiming to merge advanced substrate designs with next-generation AI semiconductor requirements.